Thermal conductive adhesive(Low temperature curing, two liquid type)

 Thermal conductive adhesive(Low temperature curing, two liquid type)

Grade Characteristics Main resin Solvent Standard curing condition Tg Shipment form
MLR-HT Suitable for low temperature curing, casting Epoxy
Amine 		Non solvent 60ﾟC / 20Hr 94ﾟC Pail

We produce  electrical insulating adhesive with high thermal conductivity  by filling dispersing fillers such as alumina and silica in these resins.

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