Thermal conductive adhesive(One liquid type)
| Product series | Characteristics | Main resin | Solvent | Standard curing condition | Tg *3(DMA) | Shipment form |
|---|---|---|---|---|---|---|
| MI |
General purpose type, High peel strength, Excellent insulation, Excellent remain stability at room temperature |
Epoxy | MEK etc | 190ﾟC / 2Hr | 130ﾟC | Pail |
| LD |
High peel strength, High Tg, Less decrease insulation in high temperature zone, Excellent remain stability at room temperature |
Epoxy | MEK etc | 190ﾟC / 2Hr | 180ﾟC | |
| LC |
Very high Tg, Less decrease insulation in high temperature zone, Excellent remain stability at room temperature |
Epoxy | MEK etc | 200ﾟC / 2Hr | 220ﾟC |
We produce electrical insulating adhesive with high thermal conductivity by filling and dispersing fillers such as alumina and silica in these resins.
There are 1.5, 2.0, 3.0, 4.0 W / m · K classes as general grade of thermal conduction, but it is also possible to adjust filler filling amount according to your request.