Thermal conductive adhesive(Low temperature curing, two liquid type)
| Grade | Characteristics | Main resin | Solvent | Standard curing condition | Tg | Shipment form |
|---|---|---|---|---|---|---|
| MLR-HT | Suitable for low temperature curing, casting |
Epoxy Amine |
Non solvent | 60ﾟC / 20Hr | 94ﾟC | Pail |
We produce electrical insulating adhesive with high thermal conductivity by filling dispersing fillers such as alumina and silica in these resins.